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TR7007Q Plus SPI sMT machine Pre Owned 3D Solder Paste Inspection

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    Buy cheap TR7007Q Plus SPI sMT machine Pre Owned 3D Solder Paste Inspection from wholesalers
     
    Buy cheap TR7007Q Plus SPI sMT machine Pre Owned 3D Solder Paste Inspection from wholesalers
    • Buy cheap TR7007Q Plus SPI sMT machine Pre Owned 3D Solder Paste Inspection from wholesalers

    TR7007Q Plus SPI sMT machine Pre Owned 3D Solder Paste Inspection

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    Brand Name : TRI
    Model Number : TR7007Q Plus
    Price : USD
    Payment Terms : L/C, D/A, D/P, T/T, Western Union, MoneyGram, Paypal
    Supply Ability : 10 units
    Delivery Time : 1 to 5 working days
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    TR7007Q Plus SPI sMT machine Pre Owned 3D Solder Paste Inspection

    TR7007Q Plus SPI SMT Machine Pre Owned 3D Solder Paste Inspection


    TR7007Q Plus High-Resolution Shadow Free 3D SPI with Enhanced 2D Lighting, for higher uniformity inspection, Pre-owned 3D Solder Paste Inspection (SPI) Machine


    The TR7007Q Plus 3D SPI platform is equipped with an improved motion controller (EtherCAT) and an enhanced 2D lighting module. The TR7007Q Plus can accurately inspect low solder bridges and compensate for board warpage for eliminating local PCB deformation. The TR7007Q Plus is equipped with up to 4 projectors to ensure a shadow-free inspection. The SPI solution eases data exchange between the production line and the MES of your choice to enable data traceability for the connected factory.


    Features:


    • Enhanced 2D Lighting, for higher uniformity inspection.
    • New motion controller, EtherCAT, for real-time measurements.
    • Smart Factory solution with Real-time SPC Trends
    • Closed Loop Ready: Feedback and Feedforward Capabilities


    Specifications:


    Optical System

    Imaging MethodStop-and-Go Imaging
    Camera4 Mpix or 12 Mpix (factory setting)
    Imaging Resolution5.5 μm, 6 μm, 10 μm , 15 µm (factory setting)
    LightingEnhanced 2D Lights (RGB+W)
    3D Technology4-way Digital Fringe Pattern
    Field of View4 MP Camera Link-
    @ 10 μm: 20.3x20.3 mm
    @ 15 μm: 30.5x30.5 mm

    12 MP Camera Link-
    @ 5.5 μm: 22.5x16.5 mm
    @ 10 μm: 40.8x30.7 mm
    @ 15 μm: 61.2x46.1 mm

    12 MP CoaXPress-
    @ 6 μm: 24.4x18.4 mm
    @ 10 μm: 40.8x30.7 mm

    Note:
    (1) TR7007Q Plus DL is not available for 5.5 μm with 12 MP Camera Link and 6 μm with 12 MP CoaXPress
    (2) The only configuration available for the TR7007LQ Plus is 6 μm with 12 MP CoaXPress

    Inspection Performance

    Imaging Speed4 MP Camera Link: Up to 3 FOV/sec
    12 MP Camera Link: Up to 1.8 FOV/sec
    12 MP CoaXPress: Up to 2.6 FOV/sec
    Height Resolution@10 μm/15 μm: 0.45 μm
    @5.5 μm/6 μm: 0.22 μm
    Max. Solder Height@10 μm/15 μm: 420 μm/750 μm
    @5.5 μm/6 μm: 210 μm/310 μm

    * on Calibration Target

    Motion Table & Control

    X-Axis ControlBallscrew + EtherCAT motion controller
    Y-Axis ControlBallscrew + EtherCAT motion controller
    Z-Axis ControlBallscrew + EtherCAT motion controller
    X-Y Axis Resolution0.5 μm
    Z-Axis Resolution1 μm

    Board Handling

    Max PCB SizeTR7007Q Plus: @5.5 & 6 μm - 400 x 330 mm, @10 & 15 μm - 510 x 460 mm
    TR7007Q Plus DL: @10 & 15 μm - 510 x 310 mm x 2 Lanes, 510 x 590 mm x 1 Lane
    TR7007LQ Plus: @6 μm - 765 x 610 mm
    PCB Thickness0.6 - 5mm
    Max PCB Weight3kg. Optional: 5kg
    Top Clearance@5.5 μm, 6 μm: 25 mm; @10 μm, 15 μm: 50 mm
    Bottom Clearance40 mm
    Edge Clearance3 mm
    Conveyor Height880 – 920 mm

    * SMEMA Compatible

    Inspection Functions

    DefectsInsufficient Paste
    Excessive Paste
    Shape Deformity
    Missing Paste & Bridging
    MeasurementHeight
    Area
    Volume
    Offset

    Dimensions

    WxDxHTR7007Q Plus: 1000 x 1400 x 1650 mm
    TR7007Q Plus DL: 1000 x 1500 x 1650 mm
    TR7007LQ Plus: 1365 x 1720 x 1710 mm

    Note: not including signal tower, signal tower height 515 mm
    WeightTR7007Q Plus: 750 kg
    TR7007Q Plus DL: 830 kg
    TR7007LQ Plus: 982 kg

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